Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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12/21/2010
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Application #:
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11575128
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Filing Dt:
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10/15/2007
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Publication #:
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Pub Dt:
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01/31/2008
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Inventors:
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Chung-Hoon Lee, Do-Hyung Kim, Keon-Young Lee
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Title:
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LIGHT EMITTING DIODE PACKAGE HAVING MULTIPLE MOLDING RESINS ON A LIGHT EMITTING DIODE DIE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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148-29 GASAN-DONG, GEUMCHEON-GU |
SEOUL, KOREA, REPUBLIC OF 158-801 |
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HOSOON LEE |
210 SW MORRISON STREET |
SUITE 400 |
PORTLAND, OR 97204 |
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