Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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12/28/2010
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Application #:
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11917233
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Filing Dt:
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10/14/2008
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Publication #:
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Pub Dt:
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04/23/2009
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Inventors:
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Kazunari Maki, Yuji Nakata
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Title:
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GOLD ALLOY WIRE FOR BONDING WIRE HAVING HIGH INITIAL BONDABILITY, HIGH BONDING RELIABILITY, HIGH ROUNDNESS OF COMPRESSION BALL, HIGH STRAIGHTNESS, AND HIGH RESIN FLOWABILITY RESISTANCE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| TOKYO BUILDING 22F, 2-7-3, MARUNOUCHI |
| CHIYODA-KU, JAPAN |
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| DARBY & DARBY PC |
| PO BOX 770 |
| NEW YORK, NY 10008-0770 |
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