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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
Issue Dt:
12/28/2010
Application #:
12264095
Filing Dt:
11/03/2008
Publication #:
Pub Dt:
05/28/2009
Inventors:
Chung-Shi Liu, Chen-Hua Yu
Title:
INTEGRATED CIRCUIT AND MANUFACTURING METHOD OF COPPER GERMANIDE AND COPPER SILICIDE AS COPPER CAPPING LAYER
Assignment: 1
Reel/Frame:
024200/0675Recorded: 04/07/2010Pages: 33
Conveyance:
"IMEC" IS AN ALTERNATIVE OFFICIAL NAME FOR "INTERUNIVERSITAIR MICROELEKTRONICA CENTRUM VZW"
Assignor:
Exec Dt:
03/18/1984
Assignee:
KAPELDREEF 75
LEUVEN, BELGIUM 3001
Correspondent:
KNOBBE MARTENS OLSON & BEAR LLP
2040 MAIN STREET
FOURTEENTH FLOOR
IRVINE, CA 92614
Assignment: 2
Reel/Frame:
022226/0115Recorded: 02/09/2009Pages: 5
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
11/13/2008
Exec Dt:
12/23/2008
Assignees:
KAPELDREEF 75
LEUVEN, BELGIUM 3001
8, LI-HSIN ROAD 6
HSIN-CHU, TAIWAN 300-077
Correspondent:
ROSE M. THIESSEN
2040 MAIN STREET, 14TH FLOOR
IRVINE, CA 92614

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