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Patent Assignment Abstract of Title
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Total Assignments: 3
Patent #:
Issue Dt:
01/04/2011
Application #:
12124925
Filing Dt:
05/21/2008
Publication #:
Pub Dt:
11/26/2009
Inventors:
Hans Dropmann, Uppili Sridhar, Carlton Stuebing
Title:
BONDED WAFER PACKAGE MODULE
Assignment: 1
Reel/Frame:
021156/0516Recorded: 06/26/2008Pages: 5
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
03/27/2008
Exec Dt:
03/05/2008
Exec Dt:
03/12/2008
Assignee:
120 SAN GABRIEL DRIVE
SUNNYVALE, CALIFORNIA 94086
Correspondent:
BLAKELY SOKOLOFF TAYLOR & ZAFMAN LLP
1279 OAKMEAD PARKWAY
SUNNYVALE, CA 94085
Assignment: 2
Reel/Frame:
025412/0283Recorded: 11/23/2010Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
11/23/2010
Assignee:
2300 NE BROOKWOOD PARKWAY
HILLSBORO, OREGON 97124
Correspondent:
BLAKELY SOKOLOFF TAYLOR & ZAFMAN LLP
1279 OAKMEAD PARKWAY
SUNNYVALE, CA 94085
Assignment: 3
Reel/Frame:
039050/0193Recorded: 06/16/2016Pages: 13
Conveyance:
MERGER (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
03/30/2016
Assignee:
7628 THORNDIKE ROAD
GREENSBORO, NORTH CAROLINA 27409
Correspondent:
WITHROW & TERRANOVA, P.L.L.C.
106 PINEDALE SPRINGS WAY
CARY, NC 27511

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