Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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01/04/2011
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Application #:
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12007361
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Filing Dt:
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01/09/2008
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Publication #:
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Pub Dt:
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08/07/2008
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Inventor:
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Ming-Feng Wu
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Title:
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PACKAGE STRUCTURE AND METHOD FOR CHIP WITH TWO ARRAYS OF BONDING PADS ON BGA SUBSTRATE FOR PREVENTING GOLD BONDING WIRES FROM COLLAPSE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 2, TECHNOLOGY RD., V. |
| SCIENCE-BASED INDUSTRIAL PARK |
| SHIN-CHU, TAIWAN ROC |
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| JOE MCKINNEY MUNCY |
| BIRCH, STEWART, KOLASCH & BIRCH, LLP |
| 8110 GATEHOUSE ROAD |
| SUITE 100 EAST, P.O. BOX 747 |
| FALLS CHURCH, VA 22040-0747 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 3F, NO. 2,TECHNOLOGY RD., V, SCIENCE-BASED INDUSTRIAL PARK, |
| HSINCHU, TAIWAN 300 |
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| CHIH FENG YEH |
| 188 OLD CASTLE POINT RD., |
| WAPPINGERS FALLS, NY 12590 |
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