Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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01/25/2011
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Application #:
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12282984
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Filing Dt:
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09/15/2008
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Publication #:
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Pub Dt:
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03/26/2009
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Inventors:
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Kiyofumi Tanaka, Satoshi Odashima, Noriyoshi Hosono, Hironobu Fujimoto, Takeshi Segawa
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Title:
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HOLDING JIG, SEMICONDUCTOR WAFER GRINDING METHOD, SEMICONDUCTOR WAFER PROTECTING STRUCTURE AND SEMICONDUCTOR WAFER GRINDING METHOD AND SEMICONDUCTOR CHIP FABRICATION METHOD USING THE STRUCTURE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 3-5, NIHONBASHI-HONCHO 4-CHOME |
| CHUO-KU, TOKYO, JAPAN 103-0023 |
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| 23-23, HONCHO |
| ITABASHI-KU, TOKYO, JAPAN 173-0001 |
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| BUCHANAN INGERSOL & ROONEY PC |
| 1737 KING STREET |
| ALEXANDRIA, VA 22313-1404 |
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