Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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02/01/2011
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Application #:
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12189165
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Filing Dt:
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08/10/2008
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Publication #:
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Pub Dt:
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07/15/2010
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Inventor:
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Hung-Tsun LIN
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Title:
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LEADLESS SEMICONDUCTOR PACKAGE WITH ELECTROPLATED LAYER EMBEDDED IN ENCAPSULANT AND THE METHOD FOR MANUFACTURING THE SAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| CANON'S COURT, 22 VICTORIA STREET |
| HAMILTOM HM 12, BERMUDA |
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| NO. 1, R&D RD. 1, SCIENCE-BASED INDUSTRIAL PARK |
| HSINCHU, TAIWAN |
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| YEN JUNG SUNG |
| 30-47 37 ST. |
| ASTORIA, NY 11103 |
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