USPTO Assignments on the Web

	United States Patent and Trademark Office
	Home\|Site Index\|Search\|Guides\|Contacts\|eBusiness\|eBiz alerts\|News\|Help

Assignments on the Web > Patent Query

Patent Assignment Abstract of Title

NOTE:Results display only for issued patents and published applications. For pending or abandoned applications please consult USPTO staff.

Total Assignments: 2

Patent #:	7884012	Issue Dt:	02/08/2011	Application #:	11864566	Filing Dt:	09/28/2007
Publication #:	20090087981	Pub Dt:	04/02/2009
Inventors:	Kenji Suzuki, Tadahiro Ishizaka, Miho Jomen, Jonathan Rullan
Title:	VOID-FREE COPPER FILLING OF RECESSED FEATURES FOR SEMICONDUCTOR DEVICES

Assignment: 1

Reel/Frame:

020139/0549

Recorded: 11/20/2007

Pages: 4

Conveyance:

ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).

Assignors:

SUZUKI, KENJI

Exec Dt:

10/15/2007

TADAHIRO, ISHIZAKA

Exec Dt:

10/15/2007

JOMEN, MIHO

Exec Dt:

10/15/2007

RULLAN, JONATHAN

Exec Dt:

10/15/2007

Assignee:

TOKYO ELECTRON LIMITED

3-6 AKASAKA 5-CHOME, MINATO-KU

TBS BROADCAST CENTER

TOKYO, JAPAN 107

Correspondent:

KRISTI L. DAVIDSON

441 VINE STREET

2700 CAREW TOWER

CINCINNATI, OH 45202

Assignment: 2

Reel/Frame:

025053/0268

Recorded: 09/28/2010

Pages: 6

Conveyance:

CORRECTIVE ASSIGNMENT TO CORRECT THE NAME OF THE SECOND ASSIGNOR FROM ISHIZAKA TADAHIRO TO TADAHIRO ISHIZAKA PREVIOUSLY RECORDED ON REEL 020139 FRAME 0549. ASSIGNOR(S) HEREBY CONFIRMS THE CORRECT NAME OF THE SECOND ASSIGNOR IS TADAHIRO ISHIZAKA AS SIGNED ON THE ORIGINAL ASSIGNMENT DOCUMENT.

Assignors:

SUZUKI, KENJI

Exec Dt:

10/15/2007