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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
02/15/2011
Application #:
12094010
Filing Dt:
05/16/2008
Publication #:
Pub Dt:
12/18/2008
Inventors:
Kenji Ogata, Masashi Nishiguchi, Kenichiro Imamura
Title:
MOLD APPARATUS FOR RESIN ENCAPSULATION AND RESIN ENCAPSULATION METHOD
Assignment: 1
Reel/Frame:
021061/0148Recorded: 06/06/2008Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
09/12/2007
Exec Dt:
09/12/2007
Exec Dt:
09/12/2007
Assignee:
12-4, NEGORO, MOMOYAMA-CHO, FUSHIMI-KU
KYOTO-SHI, KYOTO, JAPAN 612-8024
Correspondent:
BIRCH, STEWART, KOLASCH & BIRCH, LLP
P.O. BOX 747
FALLS CHURCH, VA 22040-0747

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