Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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02/22/2011
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Application #:
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12187918
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Filing Dt:
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08/07/2008
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Publication #:
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Pub Dt:
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02/12/2009
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Inventors:
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Shinji TACHIBANA, Tomohiro KAWASE, Naoyuki OMURA, Toshihisa ISONO, Koji SHIMIZU
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Title:
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ELECTROLYTIC COPPER PLATING PROCESS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 2-6, DOSHO-MACHI 3-CHOME, CHUO-KU |
| OSAKA-SHI, OSAKA, JAPAN |
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| BIRCH, STEWART, KOLASCH & BIRCH, LLP |
| P. O. BOX 747 |
| FALLS CHURCH, VA 22040-0747 |
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