Patent Assignment Abstract of Title
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
|
Total Assignments:
1
|
|
Patent #:
|
|
Issue Dt:
|
03/08/2011
|
Application #:
|
11855959
|
Filing Dt:
|
09/14/2007
|
|
Publication #:
|
|
Pub Dt:
|
03/20/2008
| | | | |
|
Inventors:
|
Nobuyuki Morimoto, Akihiko Endo
|
|
Title:
|
METHOD OF PRODUCING BONDED WAFER
|
|
|
Assignment:
1
|
|
|
|
|
|
|
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
|
|
|
|
|
|
|
|
|
| 2-1, SHIBAURA 1-CHOME, MINATO-KU |
| TOKYO, JAPAN |
|
|
|
|
| KOLISCH HARTWELL, P.C. |
| 520 S.W. YAMHILL STREET |
| 200 PACIFIC BUILDING |
| PORTLAND, OR 97204-1324 |
|
|
Search Results as of:
05/06/2024 07:06 AM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|
