Patent Assignment Abstract of Title
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Total Assignments:
4
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Patent #:
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Issue Dt:
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03/08/2011
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Application #:
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11547323
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Filing Dt:
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10/02/2006
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Publication #:
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Pub Dt:
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08/30/2007
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Inventors:
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Keisuke Kigawa, Haruyuki Hiratsuka, Tomohisa Wada
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Title:
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METHOD OF MANUFACTURING SEALED ELECTRONIC COMPONENT AND SEALED ELECTRONIC COMPONENT
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Assignment:
1
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CHANGE OF NAME (SEE DOCUMENT FOR DETAILS).
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| 1-12, TANASHICHO 6-CHOME |
| NISHITOKYO-SHI, TOKYO, JAPAN 188-8511 |
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| ALAN J. KASPER (SUGHRUE MION) |
| 2100 PENNSYLVANIA AVENUE, N.W. |
| SUITE 800 |
| WASHINGTON, DC 20037 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 4107-5, OAZA-MIYOTA |
| MIYOTAMACHI, KITASAKU-GUN |
| NAGANO, JAPAN 389-0295 |
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| ALAN J. KASPER |
| 2100 PENNSYLVANIA AVENUE, NW |
| SUITE 800 |
| WASHINGTON, GUX 20037 |
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Assignment:
3
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| 6663-2, FUNATSU, FUJIKAWAGUCHIKO-MACHI, MINAMITSURU-GUN |
| YAMANASHI, JAPAN 401-0395 |
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| CPA GLOBAL LTD |
| LIBERATION HOUSE |
| CASTLE STREET |
| ST HELIER, JE1 1BL JERSEY |
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Assignment:
4
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CHANGE OF NAME (SEE DOCUMENT FOR DETAILS).
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| 1-12, TANASHICHO 6-CHOME, NISHITOKYO-SHI, |
| TOKYO, JAPAN 188-8511 |
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| CPA GLOBAL LTD |
| LIBERATION HOUSE |
| CASTLE STREET |
| ST HELIER, JE1 1BL JERSEY |
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