Patent Assignment Abstract of Title
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Total Assignments:
6
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Patent #:
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Issue Dt:
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03/08/2011
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Application #:
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11981138
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Filing Dt:
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10/31/2007
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Publication #:
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Pub Dt:
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03/20/2008
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Inventors:
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Mou-Shiung Lin, Ming-Ta Lei, Chuen-Jye Lin
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Title:
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A STRUCTURE AND MANUFACTURING METHOD OF A CHIP SCALE PACKAGE WITH LOW FABRICATION COST, FINE PITCH AND HIGH RELIABILITY SOLDER BUMP
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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21 R&D FIRST ROAD |
SCIENCE-BASED INDUSTRIAL PARK |
HSIN-CHU, TAIWAN ROC |
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QUALCOMM INCORPORATED |
5775 MOREHOUSE DRIVE |
SAN DIEGO, CA 92121-1714 |
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Assignment:
2
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CORRECTIVE ASSIGNMENT TO CORRECT THE SPELLING OF INVENTOR MIN-TA LEI NEEDS TO BE CORRECTED TO MING-TA LEI PREVIOUSLY RECORDED ON REEL 030764 FRAME 0930. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT OF ASSIGNORS INTEREST.
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21 R&D FIRST ROAD |
SCIENCE-BASED INDUSTRIAL PARK |
HSIN-CHU, TAIWAN ROC |
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QUALCOMM INCORPORATED |
5775 MOREHOUSE DRIVE |
SAN DIEGO, CA 92121-1714 |
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Assignment:
3
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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ROOM 301/302, NO 47, PARK 2ND RD. |
SCIENCE-BASED INDUSTRIAL PARK |
HSINCHU, TAIWAN ROC |
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QUALCOMM INCORPORATED |
5775 MOREHOUSE DRIVE |
SAN DIEGO, CA 92121-1714 |
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Assignment:
4
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CORRECTIVE ASSIGNMENT TO CORRECT THE CONVEYING PARTY NAME NEEDS TO CHANGE FROM MEGICA TO MEGIC PREVIOUSLY RECORDED ON REEL 030770 FRAME 0876. ASSIGNOR(S) HEREBY CONFIRMS THE MEGIC CORPORATION TO MEGICA CORPORATION.
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ROOM 301/302, NO 47, PARK 2ND RD. |
SCIENCE-BASED INDUSTRIAL PARK |
HSINCHU, TAIWAN ROC |
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QUALCOMM INCORPORATED |
5775 MOREHOUSE DRIVE |
SAN DIEGO, CA 92121-1714 |
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Assignment:
5
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MERGER (SEE DOCUMENT FOR DETAILS).
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5775 MOREHOUSE DRIVE |
SAN DIEGO, CALIFORNIA 92121 |
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QUALCOMM INCORPORATED |
5775 MOREHOUSE DRIVE |
SAN DIEGO, CA 92121-1714 |
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Assignment:
6
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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5775 MOREHOUSE DRIVE |
SAN DIEGO, CALIFORNIA 92121 |
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QUALCOMM INCORPORATED |
5775 MOREHOUSE DRIVE |
SAN DIEGO, CA 92121 |
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