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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
04/05/2011
Application #:
11791593
Filing Dt:
05/24/2007
Publication #:
Pub Dt:
04/24/2008
Inventors:
Shigeki Chujo, Koichi Nakayama
Title:
METHOD FOR MANUFACTURING ELECTROCONDUCTIVE MATERIAL-FILLED THROUGHHOLE SUBSTRATE
Assignment: 1
Reel/Frame:
019398/0118Recorded: 05/24/2007Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
05/07/2007
Exec Dt:
05/07/2007
Assignee:
1-1, ICHIGAYA-KAGA-CHO, 1-CHOME SHINJUKU KU,
TOKYO-TO, JAPAN 1628001
Correspondent:
MICHAEL E. HILTON
HARNESS, DICKEY & PIERCE, P.L.C.
P.O. BOX 828
BLOOMFIELD HILLS, MI 48303

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