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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
04/12/2011
Application #:
12113152
Filing Dt:
04/30/2008
Publication #:
Pub Dt:
08/28/2008
Inventors:
Keith E. Fogel, Balaram Ghosal, Henry A. Nye III, Donna S. Zupanski-Nielsen et al
Title:
INTERCONNECTIONS FOR FLIP-CHIP USING LEAD-FREE SOLDERS AND HAVING REACTION BARRIER LAYERS
Assignment: 1
Reel/Frame:
028867/0216Recorded: 08/29/2012Pages: 27
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
07/18/2012
Assignee:
3050 ZANKER ROAD
SAN JOSE, CALIFORNIA 95134
Correspondent:
ALLSTON L. JONES
425 SHERMAN AVENUE, SUITE 230
PALO ALTO, CA 94306

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