Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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04/19/2011
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Application #:
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11727001
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Filing Dt:
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03/23/2007
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Publication #:
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Pub Dt:
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10/04/2007
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Inventors:
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Tadahiro Imada, Yoshihiro Nakata, Ei Yano
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Title:
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ROUGHNESS REDUCING FILM AT INTERFACE, MATERIALS FOR FORMING ROUGHNESS REDUCING FILM AT INTERFACE, WIRING LAYER AND SEMICONDUCTOR DEVICE USING THE SAME, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 1-1, KAMIKODANAKA 4-CHOME, NAKAHARA-KU |
| KAWASAKI-SHI, KANAGAWA, 211-8588, JAPAN |
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| WESTERMAN, HATTORI, DANIELS & ADRIAN, LL |
| 1250 CONNECTICUT AVENUE, NW |
| SUITE 700 |
| WASHINGTON, DC 20036 |
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