Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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04/26/2011
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Application #:
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11949800
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Filing Dt:
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12/04/2007
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Publication #:
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Pub Dt:
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06/19/2008
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Inventors:
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Nan-Jang Chen, Hong-Chin Lin
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Title:
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LEADFRAME ON HEAT SINK (LOHS) SEMICONDUCTOR PACKAGES AND FABRICATION METHODS THEREOF
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 1, DUSING RD. 1ST |
| SCIENCE-BASED INDUSTRIAL PARK |
| HSIN-CHU, TAIWAN 300, R.O.C. |
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| DANIEL R. MCCLURE |
| 600 GALLERIA PARKWAY |
| 15TH FLOOR |
| ATLANTA, GA 30339 |
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