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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
05/10/2011
Application #:
12028108
Filing Dt:
02/08/2008
Publication #:
Pub Dt:
09/11/2008
Inventors:
Shohei Hata, Naoki Matsushima, Eiji Sakamoto, Ryoji Okada, Takanori Aono, Atsushi Kazama et al
Title:
FUNCTIONAL DEVICE PACKAGE WITH METALLIZATION ARRANGEMENT FOR IMPROVED BONDABILITY OF TWO SUBSTRATES
Assignment: 1
Reel/Frame:
021065/0766Recorded: 06/06/2008Pages: 2
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
02/27/2008
Exec Dt:
02/28/2008
Exec Dt:
02/28/2008
Exec Dt:
02/28/2008
Exec Dt:
03/03/2008
Exec Dt:
03/03/2008
Exec Dt:
03/05/2008
Assignee:
2-1, SHIBAURA 1-CHOME, MINATO-KU
TOKYO, JAPAN
Correspondent:
ANTONELLI, TERRY, STOUT & KRAUS, LLP
1300 NORTH 17TH STREET - SUITE 1800
ARLINGTON, VA 22209

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