Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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05/17/2011
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Application #:
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12592597
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Filing Dt:
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11/30/2009
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Publication #:
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Pub Dt:
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06/02/2011
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Inventors:
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Limin Wang, Lei Shi, Liang Zhao, Feng Ye
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Title:
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ENCAPSULATION METHOD FOR PACKAGING SEMICONDUCTOR COMPONENTS WITH EXTERNAL LEADS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 495 MERCURY DRIVE |
| SUNNYVALE, CALIFORNIA 94085 |
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| BO-IN LIN |
| 13445 MANDOLI DRIVE |
| LOS ALTOS HILLS, CA 94022 |
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