Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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05/17/2011
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Application #:
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11991488
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Filing Dt:
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04/29/2009
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Publication #:
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Pub Dt:
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11/26/2009
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Inventors:
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Christoph Eichler, Volker H¿rle
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Title:
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METHOD FOR LATERALLY CUTTING THROUGH A SEMICONDUCTOR WAFER AND OPTOELECTRONIC COMPONENT
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| LEIBNIZSTRASSE 4 |
| REGENSBURG, GERMANY 90355 |
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| COHEN, PONTANI, LIEBERMAN & PAVANE |
| 551 FIFTH AVENUE |
| NEW YORK, NY 10176 |
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