Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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05/24/2011
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Application #:
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12100359
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Filing Dt:
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04/09/2008
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Publication #:
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Pub Dt:
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10/16/2008
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Inventors:
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Hyun-Soo Chung, Dong-Ho Lee, Nam-Seog Kim, Son-Kwan Hwang
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Title:
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CHIP STACK PACKAGE AND METHOD OF FABRICATING THE SAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 416 MAETAN-DONG, YEONGTONG-GU, SUWON-SI |
| GYEONGGI-DO, KOREA, REPUBLIC OF |
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| HOSOON LEE |
| 210 SW MORRISON STREET |
| SUITE 400 |
| PORTLAND, OR 97204 |
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