Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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06/07/2011
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Application #:
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11886973
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Filing Dt:
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09/21/2007
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Publication #:
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Pub Dt:
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02/26/2009
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Inventors:
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Hoshiaki Terao, Hideaki Kobiki, Satoshi Uenosono
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Title:
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ALLOY FOR HEAT DISSIPATION OF SEMICONDUCTOR DEVICE AND SEMICONDUCTOR MODULE, AND METHOD OF MANUFACTURING ALLOY
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 2-3, KAMISE-SHO, NIIGATA-SHI |
| NIIGATA 950-0063, JAPAN |
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| 2-3, UCHISAIWAI-CHO 2-CHOME |
| CHIYODA-KU, TOKYO 100-0011, JAPAN |
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| FRISHAUF HOLTZ GOODMAN, ET AL. |
| 220 FIFTH AVENUE |
| 16TH FLOOR |
| NEW YORK, NY 10001-7708 |
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