Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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06/28/2011
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Application #:
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12320884
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Filing Dt:
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02/06/2009
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Publication #:
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Pub Dt:
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08/12/2010
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Inventors:
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Yoshitaka Sasaki, Hiroyuki Ito, Tatsuya Harada, Nobuyuki Okuzawa, Satoru Sueki et al
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Title:
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LAYERED CHIP PACKAGE WITH WIRING ON THE SIDE SURFACES
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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678 S. HILLVIEW DR. |
MILPITAS, CALIFORNIA 95035 |
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1-13-1, NIHONBASHI, CHUO-KU |
TOKYO, JAPAN 103-8272 |
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SAE TECHNOLOGY CENTRE |
6 SCIENCE PARK EAST AVENUE HONG KONG SCIENCE PARK |
SHATIN, N.T. HONG KONG, CHINA |
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JAMES A. OLIFF |
OLIFF & BERRIDGE, PLC |
P.O. BOX 320850 |
ALEXANDRIA, VA 22320-4850 |
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