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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
7973310
Issue Dt:
07/05/2011
Application #:
12501100
Filing Dt:
07/10/2009
Publication #:
20100007001
Pub Dt:
01/14/2010
Inventors:
David Wei Wang, An-Hong Liu, Hao-Yin Tsai, Hsiang-Ming Huang, Yi-Chang Lee, Shu-Ching Ho
Title:
SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
Assignment: 1
Reel/Frame:
022942/0337Recorded: 07/10/2009Pages: 5
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
WANG, DAVID WEI
Exec Dt:
07/06/2009
LIU, AN-HONG
Exec Dt:
07/02/2009
TSAI, HAO-YIN
Exec Dt:
07/02/2009
HUANG, HSIANG-MING
Exec Dt:
07/03/2009
LEE, YI-CHANG
Exec Dt:
07/02/2009
HO, SHU-CHING
Exec Dt:
07/02/2009
Assignee:
CHIPMOS TECHNOLOGIES INC.
NO. 1, R&D RD. 1, SCIENCE BASED INDUSTRIAL PARK
HSINCHU, TAIWAN
Correspondent:
MUNCY, GEISSLER, OLDS, & LOWE PLLC
PO BOX 1364
FAIRFAX, VA 22038
Assignment: 2
Reel/Frame:
029072/0590Recorded: 10/04/2012Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
CHIPMOS TECHNOLOGIES INC.
Exec Dt:
09/26/2012
Assignee:
ZAWASHIRO DIGITAL INNOVATIONS LLC
1220 N. MARKET STREET, SUITE 804
WILMINGTON, DELAWARE 19801
Correspondent:
ZAWASHIRO DIGITAL INNOVATIONS LLC
1220 N. MARKET STREET, SUITE 804
WILMINGTON, DE 19801

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