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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
07/12/2011
Application #:
12310483
Filing Dt:
02/26/2009
Publication #:
Pub Dt:
11/19/2009
Inventor:
Tadahiro Ohmi
Title:
SEMICONDUCTOR DEVICE AND MULTILAYER WIRING BOARD
Assignment: 1
Reel/Frame:
022356/0444Recorded: 02/26/2009Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
02/20/2009
Assignees:
1-1, KATAHAIRA 2-CHOME, AOBA-KU, SENDAI-SHI
MIYAGI, JAPAN 980-8577
586-9, AZA USHIGAFUCHI, AKATSUKA, TSUKUBA-SHI
IBARAKI, JAPAN 305-0062
Correspondent:
GEORGE C. BECK
FOLEY & LARDNER LLP
WASHINGTON HARBOUR
3000 K STREET NW, SUITE 500
WASHINGTON, D.C. 20007-5143

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