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Patent Assignment Abstract of Title
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Total Assignments: 3
Patent #:
Issue Dt:
08/09/2011
Application #:
12553336
Filing Dt:
09/03/2009
Publication #:
Pub Dt:
03/03/2011
Inventors:
Roden R. Topacio, Neil McLellan
Title:
SEMICONDUCTOR CHIP WITH CONTOURED SOLDER STRUCTURE OPENING
Assignment: 1
Reel/Frame:
023189/0404Recorded: 09/03/2009Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
08/28/2009
Exec Dt:
08/28/2009
Assignee:
1 COMMERCE VALLEY DR. EAST
KEVIN O'NEIL
MARKHAM, CANADA L3T 7X6
Correspondent:
TIMOTHY M HONEYCUTT ATTORNEY AT LAW
P O BOX 1577
CYPRESS, TX 77410
Assignment: 2
Reel/Frame:
044771/0944Recorded: 01/30/2018Pages: 5
Conveyance:
SECURITY INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
12/28/2017
Assignee:
2485 AUGUSTINE DRIVE
SANTA CLARA, CALIFORNIA 95054
Correspondent:
CHRISTOPHER J. RECKAMP
311 S. WACKER DRIVE
FAEGRE BAKER DANIELS LLP
CHICAGO, IL 60606
Assignment: 3
Reel/Frame:
055766/0345Recorded: 03/30/2021Pages: 5
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
12/28/2017
Assignee:
121 W. LONG LAKE ROAD
SUITE 300
BLOOMFIELD HILLS, MICHIGAN 48304
Correspondent:
FENG XU
1526 GILPIN AVENUE
WILMINGTON, DE 19806

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