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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
08/09/2011
Application #:
11342099
Filing Dt:
01/27/2006
Publication #:
Pub Dt:
08/02/2007
Inventor:
Shin-Puu Jeng
Title:
METHOD FOR FORMING A DIELECTRIC LAYER WITH AN AIR GAP, AND A STRUCTURE INCLUDING THE DIELECTRIC LAYER WITH THE AIR GAP
Assignment: 1
Reel/Frame:
017571/0175Recorded: 05/02/2006Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
02/06/2006
Assignee:
NO. 8, LI-HSIN ROAD 6, SCIENCE BASED INDUSTRIAL PARK
HSIN-CHU, TAIWAN 300-77, R.O.C.
Correspondent:
STEVEN E. KOFFS, ESQUIRE
DUANE MORRIS LLP
30 SOUTH 17TH STREET
PHILADELPHIA, PA 19103-4196

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