Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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08/16/2011
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Application #:
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12664003
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Filing Dt:
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12/10/2009
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Publication #:
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Pub Dt:
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07/22/2010
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Inventors:
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Toyosei Takahashi, Rie Takayama, Junya Kusunoki, Hirohisa Dejima
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Title:
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RESIN COMPOSITION, FILLING MATERIAL, INSULATING LAYER AND SEMICONDUCTOR DEVICE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 5-8, HIGASHI-SHINAGAWA 2-CHOME, SHINAGAWA-KU |
| TOKYO, JAPAN 140-0002 |
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| MICHAEL A. MAKUCH |
| 1130 CONNECTICUT AVENUE, N.W.,SUITE 1130 |
| SMITH, GAMBRELL & RUSSELL |
| ATLANTA, GA 30309 |
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