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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
8004075
Issue Dt:
08/23/2011
Application #:
11739122
Filing Dt:
04/24/2007
Publication #:
20070246833
Pub Dt:
10/25/2007
Inventors:
Tasao Soga, Daisuke Kawase, Kazuhiro Suzuki, Eiichi Morisaki, Katsuaki Saito et al
Title:
SEMICONDUCTOR POWER MODULE INCLUDING EPOXY RESIN COATING
Assignment: 1
Reel/Frame:
019198/0266Recorded: 04/24/2007Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
SOGA, TASAO
Exec Dt:
04/02/2007
KAWASE, DAISUKE
Exec Dt:
04/02/2007
SUZUKI, KAZUHIRO
Exec Dt:
04/02/2007
MORISAKI, EIICHI
Exec Dt:
04/02/2007
SAITO, KATSUAKI
Exec Dt:
04/02/2007
SHIMOKAWA, HANAE
Exec Dt:
04/05/2007
Assignee:
HITACHI, LTD.
6-6, MARUNOUCHI 1-CHOME, CHIYODA-KU
TOKYO, JAPAN
Correspondent:
ALAN E. SCHIAVELLI
1300 N. 17TH STREET
SUITE 1800
ARLINGTON, VA 22209
Assignment: 2
Reel/Frame:
034153/0954Recorded: 11/12/2014Pages: 5
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
HITACHI, LTD.
Exec Dt:
08/06/2013
Assignee:
HITACHI POWER SEMICONDUCTOR DEVICE, LTD.
2-2, OMIKA-CHO 5-CHOME, HITACHI-SHI
IBARAKI, JAPAN
Correspondent:
CPA GLOBAL LIMITED
LIBERATION HOUSE
CASTLE STREET
ST HELIER, JE1 1BL JERSEY

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