Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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08/30/2011
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Application #:
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11727025
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Filing Dt:
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03/23/2007
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Publication #:
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Pub Dt:
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08/09/2007
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Inventor:
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Hirokazu Honda
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Title:
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MULTILAYER INTERCONNECTION BOARD, SEMICONDUCTOR DEVICE HAVING THE SAME, AND METHOD OF FORMING THE SAME AS WELL AS METHOD OF MOUNTING THE SEMICONDUTOR CHIP ON THE INTERCONNECTION BOARD
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 1753 SHIMONUMABE, NAKAHARA-KU |
| KAWASAKI, KANAGAWA 211-8668, JAPAN |
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| YOUNG & THOMPSON |
| 745 SOUTH 23RD STREET |
| 2ND FLOOR |
| ARLINGTON, VA 22202 |
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Assignment:
2
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CHANGE OF NAME (SEE DOCUMENT FOR DETAILS).
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| 1753 SHIMONUMABE, NAKAHARA-KU, |
| KAWASAKI-SHI, KANAGAWA, JAPAN 211-8668 |
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| SUGHRUE MION, PLLC |
| 2100 PENNSYLVANIA AVENUE, N.W. |
| SUITE 800 |
| WASHINGTON, DC 20037 |
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