Patent Assignment Abstract of Title
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Total Assignments:
3
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Patent #:
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Issue Dt:
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08/30/2011
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Application #:
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12076548
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Filing Dt:
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03/19/2008
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Publication #:
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Pub Dt:
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06/25/2009
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Inventor:
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Il Kweon Joung
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Title:
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MOLD FOR FORMING MOLDING MEMBER AND METHOD OF MANUFACTURING LED PACKAGE USING THE SAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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314 MAETAN 3-DONG, YEONGTONG-GU, SUWON |
GYUNGGI-DO, KOREA, REPUBLIC OF 443-743 |
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STAAS & HALSEY LLP |
ATTENTION: DAVID M. PITCHER |
1201 NEW YORK AVE., N.W., SUITE 700 |
WASHINGTON, D.C. 20005 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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314 MAETAN 3-DONG, YEONGTONG-GU, |
SUWON, GYUNGGI-DO,, KOREA, REPUBLIC OF |
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STAAS AND HALSEY LLP |
1201 NEW YORK AVE. NW 7TH FLOOR |
WASHINGTON, DC 20005 |
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Assignment:
3
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MERGER (SEE DOCUMENT FOR DETAILS).
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(MAETAN-DONG) 129 SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, |
SEOUL, KOREA, REPUBLIC OF |
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MCDERMOTT WILL & EMERY LLP |
600 13TH STREET, N.W. |
WASHINGTON, DC 20005-3096 |
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