Patent Assignment Abstract of Title
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Total Assignments:
3
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Patent #:
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Issue Dt:
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09/06/2011
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Application #:
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12130386
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Filing Dt:
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05/30/2008
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Publication #:
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Pub Dt:
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12/03/2009
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Inventors:
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Ping Liang Tu, Chun Hung Samuel Ip
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Title:
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METHOD OF BONDING SEMICONDUCTOR DEVICES UTILIZING SOLDER BALLS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 20/F., WATSON CENTRE |
| 16-22 KUNG YIP ST. |
| KWAI CHUNG, HONG KONG, CHINA |
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| OSTROLENK FABER GERB & SOFFEN |
| 1180 AVENUE OF THE AMERICAS |
| NEW YORK, NY 100368403 |
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Assignment:
2
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CHANGE OF NAME (SEE DOCUMENT FOR DETAILS).
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| 2 YISHUN AVENUE 7 |
| SINGAPORE, SINGAPORE 768924 |
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| CPA GLOBAL LIMITED |
| LIBERATION HOUSE |
| CASTLE STREET |
| ST HELIER, JE1 1BL JERSEY |
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Assignment:
3
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NUNC PRO TUNC ASSIGNMENT (SEE DOCUMENT FOR DETAILS).
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| 2 YISHUN AVENUE 7 |
| SINGAPORE, SINGAPORE 768924 |
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| CPA GLOBAL LIMITED |
| LIBERATION HOUSE |
| CASTLE STREET |
| ST HELIER, JE1 1BL JERSEY |
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