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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
09/06/2011
Application #:
12021586
Filing Dt:
01/29/2008
Publication #:
Pub Dt:
10/02/2008
Inventors:
Hiroshi FUKAYA, Satoshi YAMAGUCHI
Title:
SOLDERING METHOD AND APPARATUS
Assignment: 1
Reel/Frame:
020432/0452Recorded: 01/29/2008Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
12/21/2007
Exec Dt:
12/21/2007
Assignee:
SAE TECHNOLOGY CENTRE, 6 SCIENCE PARK EAST AVENUE, HONG KONG SCIENCE PARK, SHATIN, N.T.
HONG KONG, HONG KONG
Correspondent:
GREENBLUM & BERNSTEIN, P.L.C.
1950 ROLAND CLARKE PLACE
RESTON, VA 20191

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