Patent Assignment Abstract of Title
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Total Assignments:
3
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Patent #:
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Issue Dt:
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09/13/2011
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Application #:
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12307174
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Filing Dt:
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11/05/2009
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Publication #:
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Pub Dt:
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03/11/2010
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Inventors:
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Juergen Leib, Hidefumi Yamamoto
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Title:
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METHOD FOR PACKAGING ELECTRONIC DEVICES AND INTEGRATED CIRCUITS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| BLOCK 209 WOODLANDS AVE 9 |
| #01-57 / 58 WOODLANDS SPECTRUM II |
| SINGAPORE, SINGAPORE 738959 |
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| MARK SALVATORE |
| 20883 STEVENS CREEK BOULEVARD |
| SUITE 100 |
| CUPERTINO, CA 95014 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 20400 STEVENS CREEK BLVD. |
| CUPERTINO, CALIFORNIA 95014 |
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| MARK SALVATORE |
| 20883 STEVENS CREEK BOULEVARD |
| SUITE 100 |
| CUPERTINO, CA 95014 |
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Assignment:
3
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| HATTENBERGSTRASSE 10 |
| 55122 MAINZ, GERMANY |
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| DEMONT & BREYER, LLC |
| 100 COMMONS WAY |
| SUITE 250 |
| HOLMDEL, NJ 07733 |
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