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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
Issue Dt:
09/27/2011
Application #:
11887420
Filing Dt:
03/26/2009
Publication #:
Pub Dt:
08/13/2009
Inventors:
Kiwamu Tokuhisa, Kentaro Hayashi, Hironobu Kawasato
Title:
PHOTOSENSITIVE RESIN COMPOSITION AND CIRCUIT SUBSTRATE EMPLOYING THE SAME
Assignment: 1
Reel/Frame:
022462/0097Recorded: 03/26/2009Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
09/20/2007
Exec Dt:
09/20/2007
Exec Dt:
09/20/2007
Assignee:
14-1, SOTOKANDA 4-CHOME
CHIYODA-KU, TOKYO, JAPAN 101-0021
Correspondent:
WILLIAM L. BROOKS
EDWARDS ANGELL PALMER & DODGE LLP
P.O. BOX 55874
BOSTON, MA 02205
Assignment: 2
Reel/Frame:
030049/0771Recorded: 03/20/2013Pages: 17
Conveyance:
CHANGE OF NAME (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
10/01/2012
Assignee:
14-1, SOTOKANDA 4-CHOME, CHIYODA-KU
TOKYO, JAPAN
Correspondent:
BIRCH STEWART KOLASCH & BIRCH LLP
PO BOX 747
FALLS CHURCH, VA 22040-0747

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