Patent Assignment Abstract of Title
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Total Assignments:
3
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Patent #:
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Issue Dt:
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09/27/2011
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Application #:
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12190131
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Filing Dt:
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08/12/2008
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Publication #:
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Pub Dt:
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02/18/2010
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Inventors:
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Griselda Bonilla, Tien Cheng, Yun Wang, Lawrence A. Clevenger, Stephan Grunow et al
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Title:
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INTERCONNECT STRUCTURES COMPRISING CAPPING LAYERS WITH LOW DIELECTRIC CONSTANTS AND METHODS OF MAKING THE SAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NEW ORCHARD ROAD |
| ARMONK, NEW YORK 10504 |
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| CANTOR COLBURN LLP - IBM FISHKILL |
| 20 CHURCH STREET |
| 22ND FLOOR |
| HARTFORD, CT 06103 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 416, MAETAN-DONG, YEONGTONG-GU, |
| SUWON-SI, |
| GYEONGGI-DO, KOREA, DEMOCRATIC PEOPLE'S REPUBLIC OF |
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| CANTOR COLBURN LLP- IBM FISHKILL |
| 20 CHURCH STREET |
| 22ND FLOOR |
| HARTFORD, CT 06103 |
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Assignment:
3
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 60 WOODLANDS INDUSTRIAL PARK D. |
| STREET TWO |
| SINGAPORE, SINGAPORE 738406 |
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| CANTOR COLBURN LLP-IBM FISHKILL |
| 20 CHURCH ST |
| 22ND FLOOR |
| HARTFORD, CT 06103 |
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