Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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10/11/2011
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Application #:
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12055478
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Filing Dt:
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03/26/2008
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Publication #:
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Pub Dt:
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10/02/2008
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Inventors:
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Kan-Jung Chia, Shang-Wei Chen
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Title:
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A PACKAGING SUBSTRATE STRUCTURE WITH A SEMICONDUCTOR CHIP EMBEDDED THEREIN
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 6, LI-HSIN ROAD |
| SCIENCE-BASED INDUSTRIAL PARK |
| HSIN-CHU, TAIWAN |
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| SCHMEISER OLSEN & WATTS |
| 18 E UNIVERSITY DRIVE |
| SUITE # 101 |
| MESA, AZ 85201 |
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Assignment:
2
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MERGER (SEE DOCUMENT FOR DETAILS).
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| 38 HSING PONG RD. KWEI SAN INDUSTRIAL ZONE |
| TAOYUAN, TAIWAN |
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| ALBERT L. SCHMEISER |
| 18 E. UNIVERSITY DRIVE, SUITE 101 |
| MESA, AZ 85201 |
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