Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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11/01/2011
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Application #:
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12064605
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Filing Dt:
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08/27/2009
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Publication #:
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Pub Dt:
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01/21/2010
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Inventors:
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Nobuyuki Morimoto, Akihiko Endo, Etsurou Morita
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Title:
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METHOD FOR PRODUCING BONDED WAFER
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 2-1 SHIBAURA 1-CHOME |
| MINATO-KU, TOKYO, JAPAN 105-8634 |
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| SUGHRUE MION, PLLC |
| 2100 PENNSYLVANIA AVENUE, N.W. |
| WASHINGTON, DC 20037 |
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