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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
8057599
Issue Dt:
11/15/2011
Application #:
10528137
Filing Dt:
12/12/2005
Publication #:
20060150904
Pub Dt:
07/13/2006
Inventors:
Takashi Ozaki, Tomoshi Taniyama, Hiroshi Unami, Kiyohiko Maeda, Shinya Morita et al
Title:
SUBSTRATE PROCESSING APPARATUS AND METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE
Assignment: 1
Reel/Frame:
016882/0265Recorded: 12/12/2005Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
OZAKI, TAKASHI
Exec Dt:
05/10/2005
TANIYAMA, TOMOSHI
Exec Dt:
03/29/2005
UNAMI, HIROSHI
Exec Dt:
03/29/2005
MAEDA, KIYOHIKO
Exec Dt:
03/29/2005
MORITA, SHINYA
Exec Dt:
03/17/2005
TAKASHIMA, YOSHIKAZU
Exec Dt:
03/17/2005
HISAKADO, SADAO
Exec Dt:
03/30/2005
Assignee:
HITACHI KOKUSAI ELECTRIC INC.
14-20, HIGASHI-NAKANO 3-CHOME, NAKANO-KU,
TOKYO, JAPAN 164-8511
Correspondent:
ARMSTRONG, KRATZ, QUINTOS, HANSON & BROO
1725 K STREET, NW
SUITE 1000
WASHINGTON, DC 20006
Assignment: 2
Reel/Frame:
048008/0206Recorded: 12/31/2018Pages: 23
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
HITACHI KOKUSAI ELECTRIC INC.
Exec Dt:
12/05/2018
Assignee:
KOKUSAI ELECTRIC CORPORATION
3-4, KANDAKAJI-CHO
CHIYODA-KU
TOKYO, JAPAN 101-0045
Correspondent:
VOLPE & KOENIG, P.C.
30 SOUTH 17TH STREET
SUITE 1800
PHILADELPHIA, PA 19103

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