Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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11/15/2011
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Application #:
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11856635
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Filing Dt:
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09/17/2007
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Publication #:
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Pub Dt:
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02/21/2008
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Inventors:
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Erwin Victor Cruz, Elsie Cabahug, Ti Ching Shian, Venkat Iyer
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Title:
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SEMICONDUCTOR DIE PACKAGE USING LEADFRAME AND CLIP AND METHOD OF MANUFACTURING
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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5005 E. MCDOWELL ROAD, MD A700 |
PHOENIX, ARIZONA 85008 |
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SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC |
5005 E. MCDOWELL ROAD |
MD A700 |
PHOENIX, AZ 85008 |
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