Patent Assignment Abstract of Title
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
|
Total Assignments:
1
|
|
Patent #:
|
|
Issue Dt:
|
11/15/2011
|
Application #:
|
12183398
|
Filing Dt:
|
07/31/2008
|
|
Publication #:
|
|
Pub Dt:
|
03/19/2009
| | | | |
|
Inventors:
|
Ho-Ming Tong, Shin-Hua Chao, Ming-Chiang Lee, Tai-Yuan Huang, Chao-Yuan Liu et al
|
|
Title:
|
THERMALLY ENHANCED PACKAGE STRUCTURE
|
|
|
Assignment:
1
|
|
|
|
|
|
|
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
|
|
|
|
|
|
|
|
|
| 26, CHIN 3RD, RD. 811, NANTZE EXPORT |
| PROCESSING ZONE, KAOHSIUNG, TAIWAN R.O.C. |
|
|
|
| 73, KAI-FA RD., NANTZE EXPORT |
| PROCESSING ZONE |
| KAOHSIUNG R.O.C., TAIWAN 811 |
|
|
|
|
| J. C. PATENTS |
| 4 VENTURE, SUITE 250 |
| IRVINE, CA 92618 |
|
|
Search Results as of:
05/08/2024 11:32 PM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|
