Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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11/22/2011
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Application #:
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11793535
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Filing Dt:
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10/29/2007
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Publication #:
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Pub Dt:
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05/08/2008
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Inventors:
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Koichi Suzuki, Hiroshi Kawamura, Haruhiko Ohta, Yoshiyuki Abe
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Title:
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BOIL COOLING METHOD, BOIL COOLING APPARATUS, FLOW CHANNEL STRUCTURE, AND APPLIED TECHNOLOGY FIELD THEREOF
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 3, KAGURAZAKA 1-CHOME, SHINJUKU-KU |
| TOKYO 162-8601, JAPAN |
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| FRISHAUF, HOLTZ, GOODMAN & CHICK, P.C. |
| 220 FIFTH AVENUE, 16TH FLOOR |
| NEW YORK, NEW YORK 10001-7708 |
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