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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
Issue Dt:
11/29/2011
Application #:
11794649
Filing Dt:
07/02/2007
Publication #:
Pub Dt:
11/05/2009
Inventors:
Masaaki Yoshida, Satoshi Kouno
Title:
SEMICONDUCTOR WAFER INCLUDING SEMICONDUCTOR CHIPS DIVIDED BY SCRIBE LINE AND PROCESS-MONITOR ELECTRODE PADS FORMED ON SCRIBE LINE
Assignment: 1
Reel/Frame:
019591/0721Recorded: 07/02/2007Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
05/28/2007
Exec Dt:
05/29/2007
Assignee:
3-6, NAKAMAGOME 1-CHOME
OHTA-KU
TOKYO, 143-8555, JAPAN
Correspondent:
IVAN S. KAVRUKOV, ESQ.
COOPER & DUNHAM LLP
1185 AVENUE OF THE AMERICAS
NEW YORK, NEW YORK 10036
Assignment: 2
Reel/Frame:
035011/0219Recorded: 02/18/2015Pages: 23
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
10/01/2014
Assignee:
13-1, HIMEMURO-CHO, IKEDA-CITY
OSAKA, JAPAN 563-8501
Correspondent:
CPA GLOBAL LIMITED
LIBERATION HOUSE
CASTLE STREET
ST HELIER, JE1 1BL JERSEY

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