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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
11/29/2011
Application #:
12432672
Filing Dt:
04/29/2009
Publication #:
Pub Dt:
11/04/2010
Inventors:
John A. Hughes, Thomas E. Love, Eugene Lemoine, David H. Lee, Christopher Ebel
Title:
SYSTEM AND METHOD FOR MULTI-CHIP MODULE DIE EXTRACTION AND REPLACEMENT
Assignment: 1
Reel/Frame:
022623/0290Recorded: 04/30/2009Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
04/28/2009
Exec Dt:
04/28/2009
Exec Dt:
04/28/2009
Exec Dt:
04/28/2009
Exec Dt:
04/28/2009
Assignee:
PO BOX 868
NASHUA, NEW HAMPSHIRE 03061-0868
Correspondent:
GRAYBEAL JACKSON LLP
155 - 108TH AVENUE NE, SUITE 350
BELLEVUE, WA 98004

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