Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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12/13/2011
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Application #:
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12606290
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Filing Dt:
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10/27/2009
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Publication #:
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Pub Dt:
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04/28/2011
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Inventors:
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Yan Xun Xue, Jun Lu, Le Shi, Liang Zhao
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Title:
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METHOD OF ATTACHING AN INTERCONNECTION PLATE TO A SEMICONDUCTOR DIE WITHIN A LEADFRAME PACKAGE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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495 MERCURY DRIVE |
SUNNYVALE, CALIFORNIA 94085 |
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CHEIN-HWA S. TSAO |
6684 MT PAKRON DRIVE |
SAN JOSE, CA 95120 |
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