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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
01/03/2012
Application #:
10593137
Filing Dt:
09/18/2006
Publication #:
Pub Dt:
09/13/2007
Inventors:
Hikaru Okubo, Nobuki Tanaka, Itaru Watanabe
Title:
RESIN COMPOSITION AND SEMICONDUCTOR DEVICE PRODUCED BY USING THE SAME
Assignment: 1
Reel/Frame:
018326/0889Recorded: 09/18/2006Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
08/21/2006
Exec Dt:
08/21/2006
Exec Dt:
08/21/2006
Assignee:
5-8, HIGASHISHINAGAWA 2-CHOME SHINAGAWA-KU
TOKYO, JAPAN
Correspondent:
ROBERT G. WEILACHER
SMITH, GAMBRELL & RUSSELL
SUITE 3100, PROMENADE II
1230 PEACHTEE STREET
ATLANTA, GA 30309

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