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Patent Assignment Abstract of Title

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Total Assignments: 2

Patent #:	8107059	Issue Dt:	01/31/2012	Application #:	11950629	Filing Dt:	12/05/2007
Publication #:	20090051898	Pub Dt:	02/26/2009
Inventors:	In-duk HWANG, Kun-Kook PARK, Hong-sig KIM, Soo-kwan KIM
Title:	NON-INVASIVE PROBE FOR MEASURING BODY COMPONENTS AND A NON-INVASIVE BODY COMPONENT MEASUREMENT SYSTEM INCLUDING THE NON-INVASIVE PROBE

Assignment: 1

Reel/Frame:

020198/0759

Recorded: 12/05/2007

Pages: 3

Conveyance:

ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).

Assignors:

HWANG, IN-DUK

Exec Dt:

11/27/2007

PARK, KUN-KOOK

Exec Dt:

11/27/2007

KIM, HONG-SIG

Exec Dt:

11/27/2007

KIM, SOO-KWAN

Exec Dt:

11/27/2007

Assignee:

SAMSUNG ELECTRONICS CO., LTD.

416, MAETAN-DONG, YEONGTONG-GU,

GYEONGGI-DO,

SUWON-SI, KOREA, DEMOCRATIC PEOPLE'S REPUBLIC OF

Correspondent:

SUGHRUE MION, PLLC

2100 PENNSYLVANIA AVENUE, N.W.

SUITE 800

WASHINGTON, DC 20037

Assignment: 2

Reel/Frame:

020310/0457

Recorded: 01/03/2008

Pages: 5

Conveyance:

CORRECTIVE ASSIGNMENT TO CORRECT THE COUNTRY OF ASSIGNEE PREVIOUSLY RECORDED ON REEL 020198 FRAME 0759. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT OF ASSIGNOR'S INTEREST.

Assignors:

HWANG, IN-DUK

Exec Dt:

11/27/2007