Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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02/14/2012
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Application #:
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12832775
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Filing Dt:
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07/08/2010
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Publication #:
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Pub Dt:
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05/26/2011
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Inventors:
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Byung Seok Kong, Jin-Wan Park
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Title:
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LOCALIZED OVER-MOLDING DIE STRUCTURE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 231, YANGJAE-DONG, SEOCHO-GU |
| SEOUL, KOREA, REPUBLIC OF 137-938 |
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| 231, YANGJAE-DONG, SEOCHO-GU |
| SEOUL, KOREA, REPUBLIC OF 137-938 |
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| 945 YEONAM-DONG, BUK-GU |
| ULSAN, KOREA, REPUBLIC OF 683-804 |
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| MORGAN, LEWIS & BOCKIUS LLP (SF) |
| ONE MARKET, SPEAR STREET TOWER, SUITE 28 |
| SAN FRANCISCO, CA 94105 |
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