Patent Assignment Abstract of Title
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Total Assignments:
3
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Patent #:
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Issue Dt:
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02/14/2012
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Application #:
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12982956
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Filing Dt:
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12/31/2010
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Inventors:
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Ravi Prakash Srivastava, Elbert Huang
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Title:
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METHODS AND STRUCTURES TO ENABLE SELF-ALIGNED VIA ETCH FOR CU DAMASCENE STRUCTURE USING TRENCH FIRST METAL HARD MASK (TFMHM) SCHEME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 60 WOODLANDS INDUSTRIAL PARK D STREET 2 |
| SINGAPORE, SINGAPORE 738406 |
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| NEW ORCHARD ROAD |
| ARMONK, NEW YORK 10504 |
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| MUNCK CARTER, LLP |
| P.O. DRAWER 800889 |
| DOCKET CLERK |
| DALLAS, TX 75380 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 303 TERRY FOX DRIVE |
| SUITE 300 |
| OTTAWA, CANADA K2K 3J1 |
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| ALSEPHINA INNOVATIONS INC. |
| 1891 ROBERSTON ROAD |
| SUITE 100 |
| OTTAWA, K2H 5B7 CANADA |
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Assignment:
3
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RELEASE BY SECURED PARTY (SEE DOCUMENT FOR DETAILS).
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| 60 WOODLANDS INDUSTRIAL PARK D STREET 2 |
| SINGAPORE, SINGAPORE 738406 |
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| BENJAMIN PETERSEN |
| 1460 EL CAMINO REAL, 2ND FLOOR |
| SHEARMAN & STERLING LLP |
| MENLO PARK, CA 94025 |
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