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Patent Assignment Abstract of Title
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Total Assignments: 3
Patent #:
Issue Dt:
02/14/2012
Application #:
11809444
Filing Dt:
05/31/2007
Publication #:
Pub Dt:
11/08/2007
Inventors:
Tae Uk Kim, Hee Sook Na, Duk Hee Kim
Title:
THERMOPLASTIC RESIN COMPOSITION WITH LOW COEFFICIENT OF LINEAR THERMAL EXPANSION
Assignment: 1
Reel/Frame:
019425/0399Recorded: 05/31/2007Pages: 2
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
05/31/2007
Exec Dt:
05/31/2007
Exec Dt:
05/31/2007
Assignee:
290 GONGDAN-DONG, GUMI-SI
GYEONGSANGBUK-DO 730-710 SEOUL, KOREA, REPUBLIC OF
Correspondent:
MARIA PARRISH TUNGOL
5820 FIFER DRIVE
SUITE 100
ALEXANDRIA, VA 22303
Assignment: 2
Reel/Frame:
039360/0858Recorded: 07/14/2016Pages: 23
Conveyance:
MERGER (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
07/02/2014
Assignee:
150-20 GONGSE-RO
GIHEUNG-GU
YONGIN-SI, KOREA, REPUBLIC OF 17084
Correspondent:
MELISSA B. PENDLETON
10706 SIKES PLACE
SUITE 350
CHARLOTTE, NC 28277
Assignment: 3
Reel/Frame:
042114/0895Recorded: 03/30/2017Pages: 23
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
11/01/2016
Assignee:
334-27, YEOSUSANDAN-RO
YEOSU-SI, JEOLLANAM-DO
YEOSU-SI, KOREA, REPUBLIC OF 59616
Correspondent:
MELISSA B. PENDLETON
10706 SIKES PLACE
SUITE 350
CHARLOTTE, NC 28277

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